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  september 2009 doc id 3080 rev 6 1/10 10 sm15t transil? features peak pulse power: ? 1500 w (10/1000 s) ? 10 kw (8/20 s) breakdown voltage range: from 6.8 v to 220 v unidirectional and bidirectional types low leakage current: ? 0.2 a at 25 c ? 1 a at 85 c operating t j max : 150 c high power capability at t jmax : ? 1250 w (10/1000 s) jedec registered package outline complies with the following standards iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) iec 61000-4-5 ? see ta b l e 3 for surge level mil std 883g, method 3015-7: class 3b ? 25 kv hbm (human body model) ul 497b file number: qvgq2.e136224 resin meets ul 94, v0 mil-std-750, method 2026 soldererabilty eia std rs-481 and iec 60286-3 packing ipc 7531 footprint description the sm15t transil series has been designed to protect sensitive equipment against electrostatic discharges according to iec 61000-4-2, and mil std 883, method 3015, and electrical over stress according to iec 61000-4-4 and 5. these devices are more generally used against surges below 1500 w (10/1000 s). planar technology makes these devices suitable for high-end equipment and smps where low leakage current and high junction temperature are required to provide reli ability and stability over time. sm15t are packaged in smc (smc footprint in accordance with ipc 7531 standard). tm: transil is a trademar k of stmicroelectronics k a unidirectional bidirectional smc (jedec do-214ab) www.st.com
characteristics sm15t 2/10 doc id 3080 rev 6 1 characteristics figure 1. electrical characteristics - definitions figure 2. pulse definition for electrical characteristics table 1. absolute maximum ratings (t amb = 25 c ) symbol parameter value unit p pp peak pulse power dissipation (1) t j initial = t amb 1500 w t stg storage temperature range -65 to + 150 c t j operating junction temperature range -55 to + 150 c t l maximum lead temperature for soldering during 10 s. 260 c 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. table 2. thermal parameter symbol parameter value unit r th(j-l) junction to leads 15 c/w r th(j-a) junction to ambient on printed circuit on recommended pad layout 90 c/w v cl v br v rm i rm i r i pp v i i rm i r i pp v rm v br v cl v cl v br v rm i rm i r i pp v i i rm i r i pp v rm v br v cl v cl v br v rm i rm i r i pp v i i f v f v cl v br v rm i rm i r i pp v i i f v f unidirectional bidirectional symbol parameter v stand-off voltage v breakdown voltage v clamping voltage i leakage current @ v i peak pulse current t voltage temperature coefficient v forward voltage drop r dynamic resistance rm br cl rm rm pp f d 100 50 0 pulse waveform tr = rise time (s) tp = pulse duration time (s) t %i pp t p t r
sm15t characteristics doc id 3080 rev 6 3/10 table 3. electrical characteristics, parameter values (t amb = 25 c) order code i rm max@v rm v br @i r (1) v cl @i pp 10/1000 s r d 10/1000 s v cl @i pp 8/20 s r d 8/20 s t (2) 25 c 85 c min typ max max max max a v v ma v (3) a (4) v (3) a (4) 10-4/ c sm15t6v8a/ca 500 2000 5.8 6.45 6.8 7.14 10 10.5 143 0.023 13.4 746 0.008 5.7 sm15t7v5a/ca 250 1000 6.4 7.13 7.5 7.88 10 11.3 132 0.026 14.5 690 0.010 6.1 sm15t10a/ca 10 50 8.55 9.5 10 10.5 1 14.5 103 0.039 18.6 538 0.015 7.3 sm15t12a/ca 0.2 1 10.2 11.4 12 12.6 1 16.7 90 0.046 21.7 461 0.020 7.8 sm15t15a/ca 0.2 1 12.8 14.3 15 15.8 1 21.2 71 0.076 27.2 368 0.031 8.4 sm15t18a/ca 0.2 1 15.3 17.1 18 18.9 1 25.2 59.5 0.106 32.5 308 0.044 8.8 sm15t22a/ca 0.2 1 18.8 20.9 22 23.1 1 30.6 49 0.153 39.3 254 0.064 9.2 sm15t24a/ca 0.2 1 20.5 22.8 24 25.2 1 33.2 45 0.178 42.8 234 0.075 9.4 sm15t27a/ca 0.2 1 23.1 25.7 27 28.4 1 37.5 40 0.228 48.3 207 0.096 9.6 sm15t30a/ca 0.2 1 25.6 28.5 30 31.5 1 41.5 36 0.278 53.5 187 0.12 9.7 sm15t33a/ca 0.2 1 28.2 31.4 33 34.7 1 45.7 33 0.333 59.0 169 0.14 9.8 sm15t36a/ca 0.2 1 30.8 34.2 36 37.8 1 49.9 30 0.403 64.3 156 0.17 9.9 sm15t39a/ca 0.2 1 33.3 37.1 39 41.0 1 53.9 28 0.461 69.7 143 0.20 10.0 sm15t68a/ca 0.2 1 58.1 64.6 68 71.4 1 92 16.3 1.26 121 83 0.60 10.4 sm15t75a/ca 0.2 1 64.1 71.3 75 78.8 1 103 14.6 1.66 134 75 0.74 10.5 sm15t100a/ca 0.2 1 85.5 95.0 100 105 1 137 11 2.91 178 56 1.30 10.6 sm15t150a/ca 0.2 1 128 143 150 158 1 207 7.2 6.81 265 38 2.82 10.8 sm15t200a/ca 0.2 1 171 190 200 210 1 274 5.5 11.6 353 28 5.11 10.8 sm15t220a/ca 0.2 1 188 209 220 231 1 328 4.6 21.1 388 26 6.04 10.8 1. pulse test : t p < 50 ms 2. to calculate v br versus junction temperature, use the following formula: v br @ t j = v br @ 25c x (1 + t x (t j ? 25)). 3. to calculate maximum clamping voltage at othe r surge level, use the following formula: v cl = r d x i pp + v brmax. 4. surge capability given for both directions for unidirectional and bidirectional types.
characteristics sm15t 4/10 doc id 3080 rev 6 figure 5. clamping voltage versus peak pulse current (maximum values) figure 3. peak pulse power dissipation versus initial junction temperature (printed circuit board) figure 4. peak pulse power versus exponential pulse duration 0 500 1000 1500 2000 0 25 50 75 100 125 150 175 p pp (w) 10/1000 s t j (c) p (kw) pp 0.1 1.0 10.0 100.0 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 t j initial = 25 c t (ms) p i pp (a) 0.1 1.0 10.0 100.0 1000.0 1 10 100 1000 t j initial=25 c 8/20 s 10/1000 s 10 ms v cl (v) s m 15t 6v 8a s m 15t 10a s m 15t 22a s m 15t 30a s m 15t 68a s m 15t 150a s m 15t 220a
sm15t characteristics doc id 3080 rev 6 5/10 figure 6. capacitance versus reverse applied voltage (typical values, sm15txxa) figure 7. capacitance versus reverse applied voltage (typical values, sm15txxca) c (nf) 0.01 0.10 1.00 10.00 1 10 100 1000 f=1 mhz v osc =30 mv rms t j =25 c sm15t6v8a sm15t15a sm15t30a sm15t68a sm15t200a v (v) r c (nf) 0.1 1.0 10.0 1 10 100 1000 f=1 mhz v osc =30 mv rms t j =25 c sm15t6v8ca sm15t15ca sm15t30ca sm15t68ca sm15t200ca v (v) r figure 8. peak forward voltage drop versus forward current (typical values) figure 9. relative variation of thermal impedance junction to ambient versus pulse duration i (a) fm 0.1 1.0 10.0 100.0 0.0 0.5 1.0 1.5 2.0 2.5 t j =25 c t j =125 c v (v) fm 0.01 0.10 1.00 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 1.0e+03 z th(j-a) /r th(j-a) recommended pad layout t p (s) figure 10. thermal resistance junction to ambient versus copper surface under each lead figure 11. leakage current versus junction temperature (typical values) r th (j-a) (c / w) 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 printed circuit board fr4, copper thickness = 35 m s cu (cm2) i r (n a ) 1.0e+00 1.0e+01 1.0e+02 1.0e+03 1.0e+04 25 50 75 100 125 150 v r =v rm v rm 10 v v r =v rm v rm < 10 v t (c) j
ordering information scheme sm15t 6/10 doc id 3080 rev 6 2 ordering information scheme figure 12. ordering information scheme sm 15 t 100 ca surface mount surge rating 15 = 1500 w transil in smc breakdown voltage 100 = 100 v type s ca = bidirectional a = unidirectional
sm15t package information doc id 3080 rev 6 7/10 3 package information case: jedec do-214ab molded plastic over planar junction terminals: solder plated, solderable as per mil-std-750, method 2026 polarity: for unidirectional types the band indicates cathode flammability: epoxy is rated ul 94, v0 rohs package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 4. smc dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 2.90 3.20 0.114 0.126 c 0.15 0.40 0.006 0.016 d 5.55 6.25 0.218 0.246 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 l 0.75 1.50 0.030 0.059 e c l e2 e1 d a1 a2 b figure 13. smc footprint dimensions in mm (inches) figure 14. marking layout (1) 1. marking layout can vary according to assembly location. 8.19 1.54 5.11 1.54 (0.061) (0.201) (0.322) (0.124) (0.061) 3.14 y w w e z x x x e: ecopack compliance xxx: marking z: manufacturing location y: year ww: week cathode bar ( unidirectional devices only )
package information sm15t 8/10 doc id 3080 rev 6 table 5. marking order code marking order code marking sm15t6v8a mde sm15t6v8ca bde sm15t7v5a mdg sm15t7v5ca bdg sm15t10a mdp sm15t10ca bdp sm15t12a mdt sm15t12ca bdt sm15t15a mdx sm15t15ca bdx sm15t18a mee sm15t18ca bee sm15t22a mek sm15t22ca bek sm15t24a mem sm15t24ca bem sm15t27a mep sm15t27ca bep sm15t30a mer sm15t30ca ber sm15t33a met sm15t33ca bet sm15t36a mev sm15t36ca bev sm15t39a mex sm15t39ca bex sm15t68a mfp sm15t68ca bfp sm15t75a mfo sm15t75ca bfo sm15t100a mfx sm15t100ca bfx sm15t150a mgk sm15t150ca bgk sm15t200a mgv sm15t200ca bgv sm15t220a mgx sm15t220ca bgx
sm15t ordering information doc id 3080 rev 6 9/10 4 ordering information 5 revision history table 6. ordering information order code marking package weight base qty delivery mode sm15txxxa/ca (1) 1. where xxx is nominal value of v br and a or ca indicates unidirectional or bidirectional version. see table 3 for list of available devices and their order codes see table 5 on page 8 smc 0.25 g 2500 tape and reel table 7. document revision history date revision description of changes september-2001 3b last issue 19-feb-2007 4 peak pulse power figure 4 on page 4 updated. 04-feb-2009 5 updated ecopack statement. added r d columns in ta bl e 3 . updated characteristic curves, figure 3 to figure 11 . 17-sep-2009 6 document updated for low leakage current.
sm15t 10/10 doc id 3080 rev 6 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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